Semiconductor thinning faces challenges in thickness variation and surface damage. Tianjian specializes in high-end thinning wheel micron powder, achieving import substitution through nano-level dispersion technology. Breakthroughs in thickness control precision and surface quality meet the ultra-precision thinning requirements for SiC/GaN wafers. Core Advantages
Core Advantages：
Nanoscale Uniformity:
Precise particle size control with highly concentrated distribution ensures thinning thickness consistency and nanoscale roughness.
Breakthrough in Dispersion:
Fine particles without agglomeration, high proportion of single-particle dispersion, reducing scratch risks caused by powder clustering.
Wafer-Level Purity:
Tianjian's self-developed purification process ensures high product purity, non-magnetic properties, avoiding wafer surface contamination and micro-crack risks.
Uniform Micro-Edges:
High proportion of regular isometric crystals with directionally optimized micro-edge strength, improving thinning efficiency and extending wheel life.
Stable Quality:
Standardized processes, full-process batch traceability, monthly mixed sample testing + annual third-party comparison ensure product consistency and reliability.
Available Particle Size Specifications:
Specialized Micron Powder for Thinning Wheels | ||
Polishing phase | Refinement phase | Rough reduction phase |
50nm~100nm | 0.1~3μm | 3~30μm |
Provide nanoscale planarization assurance for thinning of third-generation semiconductor materials (SiC/GaN) and 300mm large wafers,
promoting import substitution and industrial chain independence.
Application Scenarios:
CVD Diamond Wafer Processing；Wafer Thinning ；Glass Substrate Processing；Optical Crystal Thinning
English
