Semiconductor dicing faces the dual challenges of low efficiency and low yield. Tianjian specializes in the development of dedicated micro-powders for semiconductor dicing, achieving significant improvements in both efficiency and yield, and compatible with slurry/wire saw process upgrades.
Core Advantages：
Nanometer Precision:
Strictly controlled particle size distribution ensures low-damage cutting surfaces.
High Purity：
High product purity, non-magnetic, eliminates wafer contamination risks.
Controlled Sharpness：
High proportion of highly active crystal forms with optimized edge geometry, effectively enhancing dicing efficiency.
Consistent Quality：
Robust quality management system with strict monitoring of key parameters ensures batch-to-batch stability. Available Particle.
Size Specifications:
Semiconductor Cutting Special Micro Powder（μm） | ||||||||
4.0 | 5.0 | 5.5 | 6.0 | 6.5 | 7.0 | 7.5 | 9.0 | 10.0 |
Provide sub-micron level process guarantee for the third-generation semiconductor materials (SiC/GaN) and large-size wafer dicing,
helping to achieve a leap in wafer dicing accuracy and yield.
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