Core Advantages：
Nanoscale Uniformity and Sharpness ：
Precise particle size distribution and high concentration ensure highly consistent diamond micro-blade dimensions, providing critical support for ultra-narrow kerf cutting and low chipping control.
Excellent Dispersion Stability：
Low agglomeration rate of fine particles and high proportion of single-particle dispersion reduce risks of chipping, wafer micro-cracks, and abnormal tool wear caused by particle clustering.
Wafer-Level High Purity：
Utilizing Tiakan’s proprietary deep purification process, the product achieves high purity with no magnetic substances, eliminating surface contamination and device failure risks during cutting,
thereby enhancing chip reliability.
Oriented Micro-Blade Reinforcement：
A high proportion of regular isometric shapes and high-integrity crystals, combined with special surface treatment, optimizes micro-blade strength and self-sharpening, improving cutting efficiency and
extending tool life.
Stringent Quality Control：
A rigorous full-process quality control system ensures consistent parameters such as particle size, crystal form, and strength across batches, providing key guarantees for long-term cutting process stability and
yield improvement.
Available Particle Size Specifications:
Applicable Cutting Stages and Recommended Particle Sizes:
Specialized Micropowder for Dicing Blades |
Precision Cutting | Semi-finish Cutting | Rough Cutting/Grooving |
0.5μm ~ 2μm | 2μm ~ 5μm | 5μm ~ 15μm |
TianJian Dicing Blade Specialized Diamond Micropowder provides critical support for high-precision cutting and yield improvement in the processing of third-generation semiconductor materials (SiC/GaN),
advanced packaging ultra-thin wafers, and high-density IC chips, contributing to the development of domestic high-end dicing technology.
Application Scenarios:
Wafer Dicing Blade
IC Chip Dicing
Electronic Ceramic Substrate Dicing
High-performance Composite Material Package Dicing
English
