Photovoltaic Wire Saw Special Micro Powder

Core Advantages:

High Strength & Wear Resistance:  

Rigorously selected high-compressive-strength, high-toughness (TI value) substrates ensure superior wear resistance of the micro-powder.

Sharp Crystal Morphology: 

High proportion of sharp crystal forms with precisely controlled plate/rod ratios guarantees efficient cutting performance.  

High Purity:  

Strictly controlled impurity content, non-magnetic interference, and improved product coating rate. 

Consistent Stability:

Fully standardized processes ensure stable and uniform performance across batches.

Precisely Meets the Stringent Requirements for Powder Sharpness and Wear Resistance in "Large-Size + Thin-Wafer" Silicon Wafer Dicingbatches.

Available Particle Size Specifications: 

Application: Manufacturing of cutting tools such as wire saws, used for processing monocrystalline silicon, polycrystalline silicon, silicon carbide, etc.

Diamond wire saw

Diamond wire cut silicon rod 

Monocrystalline silicon wafer

Solar photovoltaic panels